Method for fabricating magnetic heads having varying gap lengths on a common wafer
US5855056A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 20, 1997 |
| Grant date | Jan 5, 1999 |
| Priority date | — |
| Expiry date | Nov 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49044
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved method for forming a magnetic head which efficiently allows multiple head elements of varying gap length to be located on a common wafer. A multiple gap magnetic head is formed by depositing a first magnetic layer on a wafer such that the first layer extends across all the head element segments Two separate insulating layers are individually deposited over the first layer, with a thin etch stop barrier layer being deposited between the insulation layers over heads which are to have a narrower gap length. The top insulation layer covering the etch stop barrier layer is then removed, and a second magnetic layer deposited over all the head element segments on the wafer. In addition to simplifying the fabrication process, the etch stop layer allows tight processing control to be maintained when creating the different gap lengths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.