Process for producing a cutting die
US5855149A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1996 |
| Grant date | Jan 5, 1999 |
| Priority date | — |
| Expiry date | Nov 18, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB26F1/384
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for producing a cutting die having a metal base which carries a sharpened ridge extending along a predetermined path thereon, in which a supply of powdered metal and a laser beam are moved along the path so as to surface melt a thin layer of the metal base with the metal powder and thus form a band of fused metal powder along the path, this step being repeated to form additional layers metallurgically bonded to the base and to each other, until a ridge of metal is formed. The ridge is then sharpened to suit it for use in cutting. The ridge may have a top surface of harder material than the inner part of the ridge. The laser and powder delivery movements may be controlled by a CNC (computer numerical control) motion system. The invention includes novel dies produced by this process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.