IC-processed microneedles
US5855801A · kind A · utility
435Cited by
15References
12Claims
0Family size
Inventors
Key dates
| Filing date | Jan 7, 1997 |
| Grant date | Jan 5, 1999 |
| Priority date | — |
| Expiry date | Jan 7, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2035/00237
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of fabricating a microstructure is disclosed. The method includes providing a substrate for forming an interface region and an elongated portion extending away from the interface region. A patterned, non-planar etchable structure is formed on one side of the elongated portion of the substrate. An unetchable membrane layer is deposited atop the etchable structure. At least one etching hole is formed in the membrane layer. The etchable structure is etched by placing an etchant into the etching hole to form a cavity underneath the membrane layer, thereby producing a shaft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.