Method for fabricating a printed circuit board by curing under superatmospheric pressure
US5856068A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 1997 |
| Grant date | Jan 5, 1999 |
| Priority date | — |
| Expiry date | May 2, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for fabricating a multilayer printed circuit board, in which interlayer adhesion of the layers is greatly enhanced by curing under superatmospheric pressure. The method generally includes depositing a first resin layer (12) onto a substrate (10), which is then patterned so as to cross-link a preselected portion of the resin layer (12). A second resin layer (18) is then deposited over the first resin layer (12), and then patterned to cross-link a portion thereof. Openings in the first and second resins are developed by removing those portions of the resins that were not cross-linked during patterning. Openings (26) in the second resin layer (18) provide access to the first resin layer (12) by subsequent chemical processes. The portions of the first (12) and second (18) resin layers cross-linked during patterning remain on the substrate (10) to form permanent dielectric layers. The first resin layer (12) preferably includes a filler catalytic to plating, thereby enabling direct plating of the first resin layer (12) to form metal features within the multilayer structure. The process yields a multilayer printed circuit board that exhibits increased interlayer adhesion subsequ…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.