Patent · US Expired

Method of forming a perforated adhesive assembly

US5858155A · kind A · utility

34Cited by
17References
48Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 29, 1997
Grant dateJan 12, 1999
Priority date
Expiry dateMay 29, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/1476
  • WIPO fieldOther consumer goods
  • WIPO sectorOther fields

Abstract

A method of forming a partially perforated assembly comprising a perforated facestock material, an unperforated liner, and a self-adhesive adhering the perforated facestock material to the unperforated liner, the method comprising forming a temporary assembly including the perforated facestock material, the self-adhesive, and a temporary carrier adhered to the perforated facestock material by the self-adhesive, the perforated facestock material having been perforated by material removal of portions of the facestock material, removing the temporary carrier from its adhered relation to the perforated facestock material, and after the removing, adhering the unperforated liner to the perforated facestock material by the self-adhesive to form the partially perforated assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.