Physical vapor deposition of titanium nitride on a nonconductive substrate
US5858181A · kind A · utility
13Cited by
34References
6Claims
0Family size
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Key dates
| Filing date | Aug 25, 1993 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Aug 25, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process for physical vapor deposition of a refractory coating such as titanium nitride on a nonconductive substrate such as a ceramic substrate and the coated substrate produced thereby. The nonconductive substrate is coated by cleaning the nonconductive substrate surfaces and then depositing a first layer of a refractory metal such as titanium metal on the nonconductive substrate by physical vapor deposition. A second layer of a refractory compound such as titanium nitride is then deposited on the first layer by physical vapor deposition to produce a coated nonconductive substrate having enhanced coating adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.