Electronic circuit substrate
US5858481A · kind A · utility
7Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1997 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Jan 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/257
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic circuit substrate is sealed with a sealing material made of thermoplastic resin having a thermal-expansion coefficient close to that of a ceramic substrate by a compound filler dispersedly mixed in the sealing material. The filler includes at least two of milled fiber, glass fiber, and flaked filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.