Semiconductor device having tab tape lead frame with reinforced outer leads
US5859471A · kind A · utility
278Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1997 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Oct 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a lead frame adapted to be used for a semiconductor device, a plurality of inner leads are made of a thin conductive material for easily forming a fine pattern of the inner leads. A plurality of outer leads are integrally formed with the respective inner leads. The outer leads are coated with metal layers to increase the thickness thereof, so that a desired strength of the outer leads is obtained. A semiconductor chip is electrically connected to the inner leads. The semiconductor chip and a part of the lead frame including the inner leads are hermetically sealed with a resin and, thus, a semiconductor device is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.