Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow
US5860583A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1996 |
| Grant date | Jan 19, 1999 |
| Priority date | — |
| Expiry date | Jul 1, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An evaporative cooling vessel (100) for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The evaporative cooling vessel (100) includes a cavity (105) for holding a fugitive material (107) at the housing (111) of an electronic part to maintain the housing at or below a specified temperature. As heat is applied during solder reflow, the electronic part is subjected to a high temperature capable of allowing solder to melt. Thus, the part housing (111) of the electronic part can be controlled at a substantially lower temperature than the reflow temperature. This allows the evaporative cooling vessel (110) to use the evaporative cooling properties of the fugitive material to prevent damage to the electronic part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.