Composite structure and method for the production thereof

US5861058A · kind A · utility

Assignee

• Daimler-Benz AG · DE

Inventors

• Hans-Juergen Fuesser · Herbrechtingen, DE
• Reinhard Zachai · Sehnde, DE
• Wolfram Muench · Mannheim, DE
• Tim Gutheit · Ulm, DE
• Mona Ferguson · Ulm, DE
• Reiner Schaub · Darmstadt, DE
• Karl-Heinrich Greeb · Dreieich, DE

Key dates

• Filing date: Apr 22, 1996
• Grant date: Jan 19, 1999
• Expiry date: Apr 22, 2016

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S117/913
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A composite structure for electronic components, having a base substrate with a flat side provided with a depression, and having a cover layer which is disposed on the flat side structured by the depression, and the depression being covered to form a hollow structure. The depression in the base substrate is created prior to the deposition of the cover layer and has a clear width measured parallel to the flat side that is less than one-half of its clear depth measured before the cover layer is applied. The vapor phase deposited cover layer is formed from a material which has a sufficiently high surface tension to promote three-dimensional growth of the vapor phase deposited layer.