Process for enhanced photoresist removal in conjunction with various methods and chemistries
US5861064A · kind A · utility
Inventors
Key dates
| Filing date | Mar 17, 1997 |
| Grant date | Jan 19, 1999 |
| Priority date | — |
| Expiry date | Mar 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel method is disclosed for the removal of organic material, particularly hardened photoresist, from the surface of a substrate. Layers of organic material are removed using at least two treatment cycles, each of which includes the steps of a) applying an acid-containing composition, optionally mixed with an oxidizer, to the substrate surface, and then b) applying water to the substrate surface. The process is characterized by higher temperature spikes, shorter process times and lower chemical usage than is obtained with conventional photoresist stripping methods which do not employ repetitious treatments. The method may be practiced with spray processing equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.