Ceramic envelope device, lamp with such a device, and method of manufacture of such devices
US5861714A · kind A · utility
65Cited by
12References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 1997 |
| Grant date | Jan 19, 1999 |
| Priority date | — |
| Expiry date | Jun 27, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J61/366
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention involves a new type of feedthrough-plug member for metal halide HID lamp using PCA envelopes. The construction of the lamp housing consists of a PCA envelope and specially designed axially graded alumina-metal cermet multi-layers to eliminate cracking in cermet or PCA due to thermal stresses arising from thermal expansion mismatch. The fills are metal halides such as Na--Sc--I, rare earth halides, Hg, Sn, and inert gases. The PCA vessel and directly sealed cermet-feedthrough assemblies allow the metal halide lamps to operate at high wall temperatures with better lumen output, color temperature, and CRI.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.