System for performing contact angle measurements of a substrate
US5861946A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1997 |
| Grant date | Jan 19, 1999 |
| Priority date | — |
| Expiry date | Mar 4, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2013/0241
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system is provided for positioning a substrate having a surface required to be characterized with a contact angle measurement. The system includes a stage which supports the substrate and a dispenser assembly having a dispensing tip through which a liquid droplet having a preselected volume is dispensed onto the surface of the substrate. A first actuating mechanism moves the stage in response to first actuation signals and a second actuating mechanism which changes the vertical spacing between the dispensing tip and the surface of the substrate and dispenses the liquid droplet from the dispenser assembly in response to second actuation signals. A controller is connected to the actuating mechanisms and delivers the first and second actuation signals to the first and second actuating mechanisms, respectively, so as to place the liquid droplet at a predetermined location on the surface of the substrate for performing the contact angle measurement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.