Cooling device for mounting module
US5862038A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1997 |
| Grant date | Jan 19, 1999 |
| Priority date | — |
| Expiry date | Mar 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.