Method and apparatus for adjustment in mold thickness of a complex mold clamping system
US5863474A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1997 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Jan 24, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/6707
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and system of controlling a screw engaging position adjuster provided in a complex mold clamping system. A theoretical deviation of a screw engaging position is theoretically calculated on the basis of a distance by which a movable die has been moved from an origin set for a mold thickness adjustment in clamping process. A measured deviation of the screw engaging position is measured from a distance between a mold clamping cylinder and a movable platen in clamping process. The screw engaging position adjuster is so controlled that a difference between the theoretical deviation and the measuring deviation is within an allowable deviation having previously been set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.