Polyurethane conformal coating process for a printed wiring board
US5863597A · kind A · utility
8Cited by
16References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 23, 1996 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Jan 23, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cost-effective process for preventing mealing of a polyurethane conformal coating applied to a printed wiring board is described. The process includes utilizing a liquid photoimagable solder mask for protecting the circuitry within the board prior to applying the polyurethane conformal coating. The process further includes applying the polyurethane coating within a controlled maximum thickness of 0.0015 inches for preventing vesication of the conformal coating. Additionally, a manufactured printed circuit substrate incorporating these steps is described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.