Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
US5863970A · kind A · utility
66Cited by
14References
9Claims
0Family size
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Key dates
| Filing date | Feb 4, 1997 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Feb 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.