High molecular weight S-EB-S hot melt adhesive
US5863977A · kind A · utility
34Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1997 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Feb 12, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/24
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
This invention relates to hot melt adhesives comprising a high molecular weight polystyrene-ethylene/butylene-polystyrene block copolymer and articles constructed therefrom. This polymer is useful in a variety of hot melt adhesive applications such as food packaging adhesives, rodent traps, skin attachment adhesives, positioning adhesives, diaper tapes, low tack diaper fastening systems, foam in place gaskets, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.