Curable resin compound, method for producing the same, and cured-resin material
US5864050A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1996 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Nov 4, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/00
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a curable resin compound which is soluble in organic solvents and easy to use, and a method for producing the same. The curable resin compound comprises a structure and crosslinkable groups which end-cap the structure, the structure comprising three or four non-substituted benzene rings each of which is joined with each adjacent benzene ring by an ether or ketone linkage so that both types of linkages are present in the structure. Though the curable resin compound exhibits satisfactory solubilities in organic solvents, a composition comprising the compound can be cured by a crosslinking reaction to be insoluble in the organic solvents while being provided with improved solvent resistance and chemical resistance. Accordingly, the present invention also provides a cured-resin material derived from the aforementioned curable resin compound, the cured-resin material being excellent in solvent resistance, chemical resistance and thermal resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.