Smart microwave packaging structures
US5864123A · kind A · utility
Inventor
Key dates
| Filing date | Sep 15, 1995 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Sep 15, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S99/14
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Active elements are described which modify the heating of foodstuffs and other microwave-heatable loads and which are responsive to changes of load dielectric properties with temperature or as a result of changes of state, composition or density during heating, to the presence of absence of loads, and to the presence or absence of adjacent dielectric materials. The active elements, which may be looped slots or strips, are constituted so as to be or become resonant or non-resonant during microwave heating of the load in response to the presence or absence of the load or the presence or absence of adjacent dielectric material. The elements conveniently may be constructed of electroconductive metal or artificial dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.