Method of fabricating an electronic circuit device
US5865365A · kind A · utility
77Cited by
3References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1996 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Dec 6, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.