Electroless plating bath of iridium
US5865881A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | May 6, 1997 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | May 6, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25B9/23
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a plating bath of the hydrazine type for electroless plating on the surface of a plated substance with iridium. The first plating bath is an electroless plating bath of iridium which contains a hydrazine complex of iridium and has pH of 1-7. The second plating bath is an electroless plating bath of iridium which contains hydrazine hydrate and/or hydrazinium salt, and iridium halide and/or halogenoiridate in the molar ratio of 1-1.0 and has pH of lower than 3. The plating bath of this invention is used, for example, for producing of a junction of a cation exchange membrane and iridium, which is used for a water electrolytic cell of the macromolecule solid electrolyte type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.