Method of and apparatus for applying a film to a substrate
US5865939A · kind A · utility
1Cited by
8References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 24, 1997 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Jun 24, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/179
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of applying a film, preferably of PET, to a surface, preferably the front surface of the panel of a CRT. Resin is first applied to the surface in a predetermined pattern. The film is then pressed against a part of the surface near one edge of it by a roller. The roller is then moved across the surface to press the film onto the resin. The pressure exerted by the roller is reduced in the middle of the surface as compared with that exerted at the edge. Two different pressures may be used in the middle part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.