Method for producing thick crack-free coating from hydrogen silsequioxane resin
US5866197A · kind A · utility
8Cited by
24References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1997 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Jun 6, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention pertains to a method for producing crack-free, insoluble, greater than 1.25 .mu.m thick coatings from hydrogen silsesquioxane resin compositions. The method for producing the coating comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating the hydrogen silsesquioxane resin at a temperature of less than 500.degree. C. for a controlled period of time to produce the crack-free coating having a thickness of greater than 1.25 .mu.m. The resins may be cured in an inert or oxygen containing environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.