Release composition
US5866261A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1996 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Dec 20, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition of matter comprising: PA1 (a) about 60 to about 99 parts by weight of a curable epoxypolyorganosiloxane; PA1 (b) about 1 to about 40 parts by weight of a crosslinkable silicone hydride resin having no epoxy functionality; and PA1 (c) about 0.1 to about 5 parts by weight of an curing agent, which, upon exposure to actinic radiation is capable of curing components (a) and (b); wherein the total amount of components (a) and (b) is 100 parts by weight and wherein said composition demonstrates surface release properties when coated and cured onto a substrate is provided. The composition is particularly useful in articles of manufacture where release properties are desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.