Patent · US Expired

Semiconductor device having a plug for diffusing hydrogen into a semiconductor substrate

US5866946A · kind A · utility

8Cited by
11References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 23, 1996
Grant dateFeb 2, 1999
Priority date
Expiry dateMay 23, 2016

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10B12/038
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor device formed on a semiconductor substrate includes a layer which is substantially a barrier to hydrogen formed on the semiconductor substrate. A plug, formed of a material through which hydrogen can diffuse, is disposed in an opening through the layer and contacts a surface of the semiconductor substrate. Hydrogen may be diffused into the semiconductor substrate through the plug.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.