Patent · US Expired

Hybrid circuit with an electrically conductive adhesive

US5866951A · kind A · utility

14Cited by

10References

1Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Lothar Gademann · Rottenburg am Neckar, DE
Peter Flohrs · Reutlingen, DE
Juergen Hartmann · Ludwigshafen, DE

Key dates

Filing date	Apr 12, 1993
Grant date	Feb 2, 1999
Priority date	—
Expiry date	Apr 12, 2013

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The composite hybrid semiconductor structure contains a support plate substrate (11) with a number of at least two support connector spots (13) and a semiconductor chip or semiconductor wafer substrate (10) with a number of at least two chip connector spots (16). The structures is distinguished by a respectively thermally and electrically conducting adhesive layer (13') on the surface of the support plate substrate (11) within the areas of the support connector spots (13), where the said substrates (10, 11) with the said connector spots (13, 16) placed opposite each other and in electrically conducting and mechanically firm connection have been brought into connection with each other by the said electrically conductive adhesive layers (13').

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.