Micromechanical devices with spring tips
US5867202A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1996 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Dec 13, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0841
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A micromechanical device (50) with spring tips (60) and its method of manufacture. A micromechanical device (50) is formed such that there is a deflectable element (36) suspended by at least one hinge (24a) over an air gap, at the bottom of which are landing stops (34a). The element (36) deflects on said hinge and comes into contact with the landing stops (34a) via at least one small metal protrusion (60), or spring tip. The spring tip flexes upon contact allowing more even distribution of forces and less wear and adhesion. The spring tips are formed in standard semiconductor processing steps with the addition of patterning the metal layer (64) from which the hinges are formed to create separated metal elements. When the deflectable element is formed, the metal forming that element bonds to the separated metal elements at the tips, thereby forming the spring tips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.