Plastic shield enclosure and method of producing the same
US5867370A · kind A · utility
10Cited by
4References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 9, 1995 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Nov 9, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/3833
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A conductive first enclosure section 11 is molded through a primary molding process. At this time, a primary mold is provided so as to form openings 13 and 14 in the first enclosure section 11 for portions that needs insulation (non-conductivity). At a secondary molding process to make a non-conductive second enclosure section 12, a secondary mold is provided so as to cover the first enclosure section 11 and then non-conductive resin is filled thereinto. The openings 13 and 14 in the first enclosure section 11 are filled with the non-conductive resin, thus the rear cover 1 is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.