Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US5868608A · kind A · utility
66Cited by
33References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1996 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Aug 13, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/91
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method and apparatus for conditioning a polishing pad in which slurry is directed under pressure at the polishing pad. Additionally, energy (i.e., ultrasonic energy) may be added to the slurry as it is directed towards the polishing pad, wherein embedded material in the polishing pad is removed or dislodged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.