Highly ordered Z-pin structures
US5869165A · kind A · utility
37Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1997 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Nov 10, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/651
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Improved pin-reinforced sandwich structure ties the face sheets (typically on opposite sides of a foam core) together with a plurality of Z-pins that extend into each face sheet (through the core). The pins are arranged in a tetrahedral or hat section configuration in 2-dimensional or 3-dimensional arrangements to provide enhanced reinforcement, particularly in shear. We are able to improve the pulloff strength additionally by dimpling the core surrounding the pins to produce adhesive fillets along the pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.