Process for producing semiconductor substrate by heating to flatten an unpolished surface
US5869387A · kind A · utility
143Cited by
8References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1995 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Mar 13, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing a semiconductor substrate comprises heat-treating a substrate having a monocrystal thereon in a reducing atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.