Moldable and pigmentable heat-curable compositions capable of being used for obtaining molded articles with zero shrinkage or small expansion
US5869557A · kind A · utility
7Cited by
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27Claims
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Key dates
| Filing date | Nov 14, 1996 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Nov 14, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Moldable and pigmentable heat-curable compositions which can be employed for forming molded articles with zero or practically zero shrinkage (low profile type) or a small expansion include a heat-curable resin, a catalyst, a (meth)acrylic polymer in powder form with a dimension smaller than 150 .mu.m, at least one inorganic filler and, optionally, reinforcing fibers and organic or inorganic pigments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.