RF IC package
US5869894A · kind A · utility
114Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1997 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Jul 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The specification describes a MCM IC package with improved RF grounding. The package has at least one RF IC chip bonded to an interconnect substrate and the substrate is interconnected to an intermediate printed wiring board (IPWB). The IPWB is interconnected in turn to a system printed wiring board (SPWB). The RF IC chip is metallized on the backside, and is flip chip bonded directly to the SPWB thereby eliminating two intermediate interconnections and reducing the impedance of the interconnection between the RF chip and the SWBP.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.