Chip connection structure having diret through-hole connections through adhesive film and wiring substrate
US5870289A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1995 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Dec 14, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4007
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure for connecting an integrated circuit chip to a wiring substrate which implements high-density packaging, high-density connection, high-speed signal transmission, and low cost. An integrated circuit is connected to a wiring substrate by means of flip-chip die bonding using an adhesive film. A direct through-hole connection is formed directly below a connecting pad so as to pass through the adhesive film and the wiring substrate. This direct through-hole connection directly connects the connecting pad to the wire. As a result of reduced area and thickness of the chip, the chip is mounted in high density, and high-density inputs and outputs are implemented by means of minute two-dimensional connections. Short wire connections directly connected to the chip permit high speed signal transmission, and high reliability is ensured by the dispersion of stress. Low-cost packaging can be effected by simple processes and facilities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.