Thin support for PC board transfer system
US5871325A · kind A · utility
33Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1997 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Sep 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A transfer system that supports circuit boards as it conveys them through a reflow oven. The system uses a sag support between edge supports. The sag support does not have to move as the circuit board is transferred along the transfer system. The height of the sag support can be easily adjusted. The sag support's mounts can maintain appropriate tension in the sag support even if the sag support expands during operation. The system may use a mechanism to prevent the friction between the boards and the sag support from interfering with the movement of boards along the transfer system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.