Centerless ground feedthrough pin for an electrical power source in an implantable medical device
US5871513A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1997 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Apr 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01M50/247
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to centerless grinding methods and corresponding devices such as feedthroughs for implantable medical devices and for batteries for implantable medical devices. The present invention provides certain advantages, including the elimination of longitudinal anomalies in drawn wire and increasing the reliability of implantable medical devices. In a method of the present invention, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground to a depth past which those anomalies disappear. Centerless grinding of the present invention may be accomplished using an abrasive wheel and suitable coolant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.