Attachment apparatus for an implantable medical device employing ultrasonic energy
US5871514A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1997 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Aug 1, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49925
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method and apparatus for attaching a pre-formed header module to a hermetically sealed enclosure of an implantable medical device are described. A plurality of upstanding tabs attached to the hermetically sealed enclosure extend into a plurality of corresponding tab channels formed in the header module. The upstanding tabs are inserted into the respective tab channels during seating of the module and enclosure attachment surfaces and effect an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature such as a recess formed on or in the tab that is designed to receive molten thermoplastic material when ultrasonic energy is applied in the region of the tab channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.