Transfer molding apparatus having laminated chase block
US5871782A · kind A · utility
171Cited by
5References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 26, 1996 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Nov 26, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/228
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An improved transfer molding apparatus has a laminated chase block with many sets, which is capable of fabricating a plurality of semiconductor packages. The apparatus includes an upper plate and a movable lower plate and a plurality of posts disposed between the upper and lower plates. A plurality of laminated chase blocks is fixed to the posts. A plurality of ejecting means are disposed at one side of the chase blocks and supply means concurrently supplies a molding compound to the plurality of chase blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.