Apparatus and method for machining conductive structures on substrates
US5871868A · kind A · utility
1Cited by
7References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 1993 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Feb 26, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is an apparatus and method for machining a laminate structure to form a selected shape. The method includes forming a first layer on a substrate. A first protective structure is defined that is attached to each of the first layer and the substrate. At least a portion of the protective structure has the selected shape. The laminate structure is then machined along the first protective structure thereby forming at least a portion of the selected shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.