Liquid epoxy resin composition
US5872196A · kind A · utility
24Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1996 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Jan 24, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/4223
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a liquid resin composition comprising (1) a liquid epoxy resin, (2) a particular ester curing agent, and (3) a curing accelerator. This epoxy resin composition can provide a cured resin with excellent heat resistance and water resistance, which is particularly useful for encapsulation, casting and adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.