Polymethacrylate molding compound with ethylene
US5872202A · kind A · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1997 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Dec 22, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F220/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a molding mass which can be thermoplastically processed, characterized in that it consists of monomer units of PA1 a) 80-99.9 wt.- % methyl methacrylate, PA1 b) 0.1-20 wt.- % ethylene, PA1 c) 0-19.9 wt.- % other comonomers. The invention further relates to a method for the production of the molding mass, as well as molded elements made from it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.