Using fusible films having windows supplied with adhesive and gap material
US5872583A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1995 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Dec 20, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An ink supply port forming substrate 21, a common ink chamber forming substrate 25, and a nozzle plate 27 are bonded together, by inserting between them thermally fusible films 31and 32 respectively, in which are formed through holes 45 and 45 at two or more positions, and by also filling the film through holes with an adhesive that is mixed with a gap material G for adjusting the thicknesses of the thermally fusible films when they are fused, so as to form a flow path unit 30; and then the flow path unit 30 and the actuator units 1 are bonded together by inserting between them a thermally fusible film 33, in which are through holes 64 at two or more positions, and by also filling the through holes with an adhesive that is mixed with a gap material G for adjusting the thickness of the thermally fusible film when it is fused. In this structure, the extruded quantity of the thermally fusible films can be received by the through holes 45 and 64, and the gap materials G can prevent the thermally fusible films from being unnecessarily spread out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.