Electronic apparatus, housing for electronic apparatus and housing manufacturing method
US5872699A · kind A · utility
73Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1996 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Jul 19, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronic apparatus comprising a housing, and an electronic part accommodated in the housing, wherein the housing includes a metallic member and a resin member molded integrally with the metallic member, the metallic member forming an outside part of the housing and being treated on its outer surface for enhancing a coefficient of heat radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.