High-thermal-conductivity sealed package for fiber optic coupling to an optoelectronic device
US5872881A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1997 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Feb 12, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4251
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A hermetically sealed package for an optoelectronic device such as a diode laser comprises a side wall welded to a thermally conductive heat sink mount, and a lid welded to the side wall. Testing and alignment of the device are performed before the attachment of the side wall to the mount. Feedthroughs for optical fibers and electrical connections run through the side wall. The feedthrough seals are established within projections extending away from the side wall, to protect the seals from melting during welding steps. A high-resistivity piece is present at the interface between the side walls and the base, to provide heating localized to the interface, and thereby reduce the heating of the laser during welding. The mount is pressed into a receiving structure, which is attached to an external heat sink. The bottom surface of the mount protrudes from the receiving structure, and is in direct contact with the external heat sink. In an alternative embodiment, the optoelectronic device and optical fiber are encapsulated in epoxy after optical and electrical testing and alignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.