Technique for attaching a stiffener to a flexible substrate
US5873162A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1997 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Feb 11, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The technique involves attaching a stiffener to a flexible substrate that has solder balls on the substrate. The steps include locating the flexible substrate on the stiffener with the solder balls on the side away from the stiffener, and drawing a vacuum to hold the flexible substrate in place. Locating the stiffener on a support with a pressure sensitive adhesive on a surface facing away from the support, and drawing a vacuum to hold the stiffener in place. Then, applying a pressure around the solder balls against the flexible substrate in the order of 2000 pounds per square inch to force the flexible substrate against the stiffener.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.