Heat-curing, solvent-free one-component adhesives which are based on polyurethanes and which do not give off elimination products, a process for their preparation, and their use
US5874173A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 11, 1997 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Jul 11, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31605
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat-curing, solvent-free one-component adhesives which are based on polyurethanes and which do not give off elimination products, and which are derived from A) a hardener component consisting of polyaddition products containing hydroxyl and uretdione groups, B) a binder component comprising 1,2-epoxide compounds having more than one 1,2-epoxide group and one or more hydroxyl groups in the molecule, C) catalysts for polymerizing epoxide groups, optionally D) further hydroxyl-containing compounds and optionally E) auxiliaries and additives known from adhesives technology; a process for preparing these compounds and to their use as heat-curing, one-component, solvent-free, thermally stable and solvent-resistant polyurethane (PU) adhesives which do not give off elimination products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.