Patent · US Expired

Method for electrically connecting a semiconductor chip to at least one contact surface and smart card module and smart card produced by the method

US5874354A · kind A · utility

13Cited by

5References

2Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Josef Heitzer · Neutraubling, DE
Josef Kirschbauer · Blaibach, DE
Peter Stampka · Burglengenfeld, DE

Key dates

Filing date	Mar 26, 1998
Grant date	Feb 23, 1999
Priority date	—
Expiry date	Mar 26, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/20752
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for electrically connecting a semiconductor chip to at least one contact surface uses a thin wire having a first end welded to the at least one contact surface and a second end connected to a contact zone of the semiconductor chip. In order to produce a good connection between the wire and the contact zone of the semiconductor chip, the second end of the wire is welded to a metal piece in the form of a wedge which is disposed on the contact zone of the semiconductor chip and is connected in a conductive manner thereto. The metal piece is formed by a nailhead contact having a free end which is guided in a loop and is connected to the nailhead by a wedge contact. A smart card module and a smart card are produced by the method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.