Patent · US Expired

Hot-melt adhesives based on ethylene/alkyl (meth)acrylate copolymer and on poly-alpha-olefin and uses thereof

US5874497A · kind A · utility

3Cited by

6References

9Claims

0Family size

Inventors

Peter Schellenbeck · Mainz, DE
Markus Krieger · Langenselbold, DE
Wolgang Reuss · Scheinfeld, DE
Thierry Dreyfus · Margny-lès-Compiègne, FR

Key dates

Filing date	Jun 10, 1997
Grant date	Feb 23, 1999
Priority date	—
Expiry date	Jun 10, 2017

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2666/04
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The invention relates to hot-melt adhesives characterized in that they include: a) 30 to 90% by weight (A) of at least one essentially amorphous poly-alpha-olefin and (B) of at least one ethylene/alkyl (meth)acrylate copolymer, the weight ratio (B)/(A)+(B) being between 0.05 and 0.55; b) 10 to 70% by weight of a tackifying resin; c) 0.1 to 3 parts by weight of an antioxidant for 100 parts by weight of the compounds under a) and b). It also relates to the use of these adhesives in the wood, bookbinding and packaging industries.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.