Semiconductor device having the inner end of connector leads displaced onto the surface of semiconductor chip
US5874783A · kind A · utility
7Cited by
11References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 25, 1997 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Jul 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes connector leads which have an offset portion supported by the primary surface of a semiconductor chip on which electronics circuitry is formed into an integrated circuit. The offset portion is disposed near the contact pads for connecting the electronics circuitry. The remaining portion of the connector leads far from the contact pads is spaced from the primary surface by an adhesive strip of electrically insulative material. Bonding wires connect the connector leads to the contact pads. The total thickness of the package is reduced to accomplish a thinner and flatter semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.